INTERFLUX®
i-Flex 400 is a No-clean, lead-free solder wire with a chemically modified rosin that has been developed to give very low residue formation.
i-Flex 400 has good wetting properties on virtually all standard surface finishings in electronics assembly.
The residues after soldering are minimal and a hand soldered solder joint can hardly be distinguished from a wave soldered or reflowed solder joint.
Moreover, i-Flex 400 is absolutely halogen free, providing for very safe residues after soldering.
i-Flex 400 is classified as RO/L0
Available standard alloys are:
SnCu
SAC0307
SAC305
SAC387/ SAC405
SnAg
IF 14-09 solder wire
Application:
The i-Flex 400 should be applied slightly to the point where component, pad and soldering tip meet.
Add subsequently, without interrupting the heat supply, the correct amount of solder.
Recommended soldering tip temperature setting is 320°C-360°C (625°F-680°F) when soldering of more dense materials is required (Ni,Zn,…), a temperature up to 400°C (750°F) is allowed.
i-Flex 400 is a No-clean, lead-free solder wire with a chemically modified rosin that has been developed to give very low residue formation.
i-Flex 400 has good wetting properties on virtually all standard surface finishings in electronics assembly.
The residues after soldering are minimal and a hand soldered solder joint can hardly be distinguished from a wave soldered or reflowed solder joint.
Moreover, i-Flex 400 is absolutely halogen free, providing for very safe residues after soldering.
i-Flex 400 is classified as RO/L0
Available standard alloys are:
SnCu
SAC0307
SAC305
SAC387/ SAC405
SnAg
IF 14-09 solder wire
Application:
The i-Flex 400 should be applied slightly to the point where component, pad and soldering tip meet.
Add subsequently, without interrupting the heat supply, the correct amount of solder.
Recommended soldering tip temperature setting is 320°C-360°C (625°F-680°F) when soldering of more dense materials is required (Ni,Zn,…), a temperature up to 400°C (750°F) is allowed.