INTERFLUX®
Flexsol 903 is a rosin based, absolutely halogen free, no-clean solder wire.
Flexsol 903 is designed to minimize spattering during soldering.
It wets faster and spreads more than similar products, even with SnCu alloys.
Total soldering times close to those of the SnPb alloys.
Flux content 2,2% or 3,5%.
Flexsol 903 key features include:
SAC305
SnCu0,7
The Flexsol 903 should be applied slightly to the point where component, pad and soldering tip meet.
Add subsequently, without interrupting the heat supply, the correct amount of solder.
Recommended soldering tip temperature setting is 320°C-360°C (625°F-680°F) when soldering of more dense materials is required (Ni,Zn,…), a temperature up to 420°C (790°F) is allowed.
Flexsol 903 is a rosin based, absolutely halogen free, no-clean solder wire.
Flexsol 903 is designed to minimize spattering during soldering.
It wets faster and spreads more than similar products, even with SnCu alloys.
Total soldering times close to those of the SnPb alloys.
Flux content 2,2% or 3,5%.
Flexsol 903 key features include:
- very low spattering
- halide free: (0.00% halides)
- prolongs solder tip life
- 3 flux channels
- suited for automatic (robotic) soldering
SAC305
SnCu0,7
The Flexsol 903 should be applied slightly to the point where component, pad and soldering tip meet.
Add subsequently, without interrupting the heat supply, the correct amount of solder.
Recommended soldering tip temperature setting is 320°C-360°C (625°F-680°F) when soldering of more dense materials is required (Ni,Zn,…), a temperature up to 420°C (790°F) is allowed.