The New Stand Alone Spray Fluxer uses Multi-Flux Layer Concept in combination with its proven Full Cone Spray Nozzle to overcome both the Through Hole Penetration and cleanliness of the printed circuit boards. The Multi-Flux Layer Concept guarantees sufficient flux inside the holes without excess of flux on the PCB surface. With the NEW ICSF Spray Fluxer, it secures the 100% Hole Filling with fLux.
Stand Alone Spray Fluxer System New ICSF-Solus and ICSF-Solum
Key Features
Ensures good filling of the through holes
Multi-Flux Layer Concept
Low Spray Pressure
Suitable for VOC-Free Fluxes
Minimum Setup Time
Description
Stand Alone Unit with Continues and Discontinues Spray Options.
Easy Flux Quantity Control (Settings on PLC).
Spray pressure PID control.
Flux Supply with filter direct from the drum.
Ventury Nozzle design reduces the risk on clogging the Nozzle.
Emergency Stop, Tower Light.
One Nozzle for all types of Fluxes (up to 35% solid content).
Stepper Motor or Pneumatic Controlled Nozzle Movement.
Stepper Motor Controlled Chain Conveyor.
Stepper Motor Controlled Conveyor Width adjustment.
Low level alarm for the flux drum (1 or 2 ).
Optional Integrated Ventilation with Filter.
Spray Fluxer designed to reduce residue built-up.
Optional Link to Wave soldering machine conveyor.
Safety feature while starting up the system.
Plug and Play of wires and tubing for easy maintenance.
Use of high quality components
Recipe library on 8.4” or 3,7" Touch Screen
TECHNICAL DATA
Power Supply : VAC, 50/60 Hz, 150W
Compressed Air Supply : Clean, dry and oil free at 4~6 Bar, 100~ 120 l/min
Operating Condition : 18 ~ 50 °C
Exhaust Requirement : 350 CFM (adjustable)
Conveyor speed limit : 0 ~ 3 m/min
Nozzle Air Consumption : 0.046 m3/min at 1 Bar
Spraying Width : Full Cone Diameter of 40 mm at Spray Distance of 50mm
Spray Angle : 50° ~ 95° (70° at 1 Bar)
Spray Distance : 40 ~ 50 mm from PCBA bottom to top of nozzle
Flux solids content (%) : up to 35%
Flux Flow Rate : 0 ~ 3 l/h at 1 bar (see below chart for details)
Flux Spray Pressure : 0 ~ 1.5 Bar
Medium droplet size : 50 ~ 100 mm depending on liquid flow rate and air pressure.
Deposition Uniformity : ± 15 %
Deposition Repeatability : ± 10 %
Stand Alone Spray Fluxer System New ICSF-Solus and ICSF-Solum
Key Features
Ensures good filling of the through holes
Multi-Flux Layer Concept
Low Spray Pressure
Suitable for VOC-Free Fluxes
Minimum Setup Time
Description
Stand Alone Unit with Continues and Discontinues Spray Options.
Easy Flux Quantity Control (Settings on PLC).
Spray pressure PID control.
Flux Supply with filter direct from the drum.
Ventury Nozzle design reduces the risk on clogging the Nozzle.
Emergency Stop, Tower Light.
One Nozzle for all types of Fluxes (up to 35% solid content).
Stepper Motor or Pneumatic Controlled Nozzle Movement.
Stepper Motor Controlled Chain Conveyor.
Stepper Motor Controlled Conveyor Width adjustment.
Low level alarm for the flux drum (1 or 2 ).
Optional Integrated Ventilation with Filter.
Spray Fluxer designed to reduce residue built-up.
Optional Link to Wave soldering machine conveyor.
Safety feature while starting up the system.
Plug and Play of wires and tubing for easy maintenance.
Use of high quality components
Recipe library on 8.4” or 3,7" Touch Screen
TECHNICAL DATA
Power Supply : VAC, 50/60 Hz, 150W
Compressed Air Supply : Clean, dry and oil free at 4~6 Bar, 100~ 120 l/min
Operating Condition : 18 ~ 50 °C
Exhaust Requirement : 350 CFM (adjustable)
Conveyor speed limit : 0 ~ 3 m/min
Nozzle Air Consumption : 0.046 m3/min at 1 Bar
Spraying Width : Full Cone Diameter of 40 mm at Spray Distance of 50mm
Spray Angle : 50° ~ 95° (70° at 1 Bar)
Spray Distance : 40 ~ 50 mm from PCBA bottom to top of nozzle
Flux solids content (%) : up to 35%
Flux Flow Rate : 0 ~ 3 l/h at 1 bar (see below chart for details)
Flux Spray Pressure : 0 ~ 1.5 Bar
Medium droplet size : 50 ~ 100 mm depending on liquid flow rate and air pressure.
Deposition Uniformity : ± 15 %
Deposition Repeatability : ± 10 %