Interflux® LP 5720 is a no-clean solder paste with optimized printing stability and transparent residue after reflow, in lead-free and SnPb(Ag) alloys.
LP 5720 is the successor of DP 5505.
RO L0 to IPC and EN standards.
Halide content 0,00%
LP 5720 is the successor of DP 5505.
RO L0 to IPC and EN standards.
Halide content 0,00%
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High stability on the stencil
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Absolutely halide-free
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For SnPb(Ag) alloys
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For Lead-free alloys
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Transparent post reflow residue